A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Conference paper
Publications
14466 results for Physical Sciences
MOSFET performance scaling: Limitations and future options
- Dimitri A. Antoniadis
- Ali Khakifirooz
- 2008
- IEDM 2008
Conference paperAnalytical model for RESET operation of phase change memory
- B. Rajendran
- J. Karidis
- et al.
- 2008
- IEDM 2008
Conference paperWavefront generated by reflection of a plane wave from a conic section
- John A. Hoffnagle
- David L. Shealy
- 2008
- SPIE Optical Engineering + Applications 2008
Conference paperSMT and enhanced SPT with Recessed SD to improve CMOS Device Performance
- S. Fang
- S.S. Tan
- et al.
- 2008
- ICSICT 2008
Conference paperQueue machines for next generation computer systems
- Masahiro Sowa
- Arquimedes Canedo
- 2008
- IWMST 2008
Conference paper32nm general purpose bulk CMOS technology for high performance applications at low voltage
- F. Arnaud
- J. Liu
- et al.
- 2008
- IEDM 2008
Conference paperResist-based polarization monitoring for 193nm high-numerical aperture lithography
- Richard Tu
- Gregory McIntyre
- 2008
- Lithography Asia 2008
Conference paperIntegration of polymer self-assembly for lithographic application
- Joy Y. Cheng
- Daniel P. Sanders
- et al.
- 2008
- SPIE Advanced Lithography 2008
Conference paperExperimental and theoretical analysis of factors causing asymmetrical temperature dependence of vt in High-k Metal gate CMOS with capped High-k techniques
- Ryosuke Iijima
- Mariko Takayanagi
- 2008
- IEDM 2008
Conference paper