3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Conference paper
Publications
283 results for AI Hardware
Frequency Injection Locking-Controlled Oscillations for Synchronized Operations in VO2 Crossbar Devices
- Elisabetta Corti
- Corentin Delacour
- et al.
- 2021
- DRC 2021
Conference paperDither computing: a hybrid deterministic-stochastic computing framework
- 2021
- ARITH 2021
Conference paperRaPiD: AI Accelerator for Ultra-Low Precision Training and Inference
- Swagath Venkataramani
- Vijayalakshmi Srinivasan
- et al.
- 2021
- ISCA 2021
Conference paperHERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- Riduan Khaddam-Aljameh
- Milos Stanisavljevic
- et al.
- 2021
- VLSI Circuits 2021
Conference paperFully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
Conference paperA Flexible and Fast PyTorch Toolkit for Simulating Training and Inference on Analog Crossbar Arrays
- Malte J. Rasch
- Diego Moreda
- et al.
- 2021
- AICAS 2021
Conference paperBit Error Robustness for Energy-Efficient DNN Accelerators
- David Stutz
- Nandhini Chandramoorthy
- et al.
- 2021
- MLSys 2021
Conference paperHardware-aware Automated AI for Efficient Deep Learning across Hybrid Deployments: Current Landscape and Future Directions
- 2021
- ISPASS 2021
Workshop paperA 7nm 4-Core AI Chip with 25.6TFLOPS Hybrid FP8 Training, 102.4TOPS INT4 Inference and Workload-Aware Throttling
- Ankur Agrawal
- Saekyu Lee
- et al.
- 2021
- ISSCC 2021
Conference paper