Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Conference paper
Publications
3606 results for Mathematical Sciences
Group signatures and more from isogenies and lattices: generic, simple, and efficient
- Ward Beullens
- Samuel Dobson
- et al.
- 2023
- Designs, Codes, and Cryptography
PaperThe evolution of heterogeneous integration and packaging for the age of chiplets
- Spyridon Skordas
- 2023
- MEMS/NEMS/MOEMS 2023
Conference paperImpact of high-NA half-field to full-field overlay performance by Monte Carlo simulations
- Romain Lallement
- Daniel Schmidt
- et al.
- 2023
- OEN 2023
Conference paperMethodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes
- Nicholas A. Lanzillo
- A. Chu
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Conference paperOverlay Performance in Permanent Bonded Wafer Integration Schemes
- Nathan Ip
- Michael Belyansky
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Conference paperEUV sub-resolution assist feature impact: experimental and simulation evaluation
- Zheng Chen
- Martin Burkhardt
- et al.
- 2023
- OEN 2023
Conference paperWhen Machine Learning meets Dynamical Systems: Theory and Applications
- Lam Nguyen
- Trang H. Tran
- et al.
- 2023
- AAAI 2023
WorkshopKnowledge-augmented Risk Assessment (KaRA): a hybrid-intelligence framework for supporting knowledge-intensive risk assessment of prospect candidate
- Carlos Raoni De Alencar Mendes
- Emilio Ashton Vital Brazil
- et al.
- 2023
- AAAI 2023
Workshop paperOptimization with Constraint Learning
- S. Ilker Birbil
- Donato Maragno
- et al.
- 2023
- AAAI 2023
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