Plasma Etching of Silicon in SF6: Experimental and Reactor Modeling Studies
- Yeong-Jyh Lii
- Jacob Jorné
- et al.
- 2019
- JES
Paper
Publications
509 results at JES
Reactive Ion Etching of PECVD n+ a-Si:H: Plasma Damage to PECVD Silicon Nitride Film and Application to Thin Film Transistor Preparation
- M.S. Crowder
- 2019
- JES
PaperAn XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
- N.J. Chou
- D.W. Dong
- et al.
- 2019
- JES
PaperInteraction Between ti and SiO2
- C.-Y. Ting
- M. Wittmer
- et al.
- 2019
- JES
PaperPlating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES
PaperLaser-Enhanced Electrodeposition of Lead-Tin Solder
- M. Datta
- L.T. Romankiw
- 2019
- JES
PaperA Diffusion Model for Electron-Hole Recombination in Zn2SiO4:(Mn, As) Phosphors
- D.J. Robbins
- N. Caswell
- et al.
- 2019
- JES
PaperThe Properties of electrochromic film electrodes of lanthanide diphthalocyanines in ethylene glycol
- D.J. Schiffrin
- 2019
- JES
PaperProcess Damage and Contamination Effects for Shallow Si Implanted GaAs
- H. Baratte
- A.J. Fleischman
- et al.
- 2019
- JES
PaperNear-Surface Damage and Contamination after CF4/H2 Reactive Ion Etching of Si
- G.S. Oehrlein
- R.M. Tromp
- et al.
- 2019
- JES
Paper