The Effects of Pressure, Temperature, and Time on the Annealing of lonizing Radiation Induced Insulator Damage in N-channel IGFET's
- A. Reisman
- C.J. Merz
- 2019
- JES
Paper
Publications
26917 results for Science
Thermally Developable, Positive Tone, Oxygen RIE Barrier Resist for Bilayer Lithography
- Hiroshi Ito
- Mitsuru Ueda
- et al.
- 2019
- JES
PaperA TEM Study of the Effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy
- Jean Horkans
- Jungihl Kim
- et al.
- 2019
- JES
PaperApplication of Chemical and Electrochemical Micromachining in the Electronics Industry
- Madhav Datta
- Lubomyr T. Romankiw
- 2019
- JES
PaperConducting Transition Metal Oxides: Possibilities for RuO2in VLSI Metallization
- L. Krusin-Elbaum
- M. Wittmer
- 2019
- JES
PaperLaser-Assisted Etching of Manganese-Zinc-Ferrite
- Brian W. Hussey
- Arunava Gupta
- et al.
- 2019
- JES
PaperElectrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- C.-Y. Ting
- B.L. Crowder
- 2019
- JES
PaperPd+2/poly(acrylic acid) thin films as catalysts for electroless copper deposition: Mechanism of catalyst formation
- Robert L. Jackson
- 2019
- JES
PaperA Study of the Copper/Cyanide Solution Interphase by Polarization Modulated FT-IR Spectroscopy
- J.G. Gordon
- W.G. Golden
- et al.
- 2019
- JES
PaperHollow Cathode Etching of Si and SiO2 Using CF4 and H2
- G. Fortuño-Wiltshire
- G.S. Oehrlein
- 2019
- JES
Paper