Parametric study of NiFe and NiFeCo high density plasma etching using CO/NH3
- K.B. Jung
- J. Hong
- et al.
- 1999
- JES
Paper
Publications
509 results at JES
Comparison of Cl2/He, Cl2/Ar, and Cl2/Xe plasma chemistries for dry etching of NiFe and NiFeCo
- K.B. Jung
- H. Cho
- et al.
- 1999
- JES
PaperStress-Corrosion Cracking of Low-Dielectric-Constant Spin-On-Glass Thin Films
- Robert F. Cook
- Eric G. Liniger
- 1999
- JES
PaperThe thermal stability of CoSi2 on polycrystalline silicon: The effect of silicon grain size and metal thickness
- J.P. Gambino
- E.G. Colgan
- et al.
- 1998
- JES
PaperEffect of benzotriazole on the anisotropic electrolytic etching of copper
- Demetrius Papapanoyiotou
- Hariklia Deligianni
- et al.
- 1998
- JES
PaperInterface state capture cross section measurements on vacuum annealed and radiation damaged Si:SiO2 surfaces
- M.J. Uren
- V. Nayar
- et al.
- 1998
- JES
PaperSurface finishing of high speed print bands: I. A prototype tool for electrochemical microfinishing and character rounding of print bands
- M. Datta
- J.C. Andreshak
- et al.
- 1998
- JES
PaperBoron in polycrystalline SixGe1-x films: Phase diagram and solid solubility
- D. Mangelinck
- P.-E. Hellberg
- et al.
- 1998
- JES
PaperNovel low k dielectrics based on diamondlike carbon materials
- A. Grill
- V.V. Patel
- et al.
- 1998
- JES
PaperSurface finishing of high speed print bands: II. An electrochemical process for microfinishing of hardened Fe-13Cr stainless steel
- M. Datta
- L. Romankiw
- 1998
- JES
Paper