Constriction-Induced Local Electrodeposition The Principle of Self-Induced Repair
- C. Julian Chen
- 2019
- JES
Paper
Publications
26944 results for Science
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
PaperCurrent status of reduced temperature silicon epitaxy by chemical vapor deposition
- B.S. Meyerson
- 2019
- JES
PaperDependence on the NiP Surface Treatment
- Doreen DiMilia
- Jean Horkans
- et al.
- 2019
- JES
PaperMnFe and NiFe Thin Films and Magnetic Exchange Bilayers
- Michael A. Russak
- S.M. Rossnagel
- et al.
- 2019
- JES
PaperChemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: II. Plasma Enhanced Deposition
- James H. Comfort
- Rafael Reif
- 2019
- JES
PaperCorrelation of Surface Wettability and Corrosion Rate for Benzotriazole-Treated Copper
- Richard R. Thomas
- Vlasta A. Brusic
- et al.
- 2019
- JES
PaperSurface Modifications of Electronic Materials Induced by Plasma Etching
- G.S. Oehrlein
- S.W. Robey
- et al.
- 2019
- JES
PaperThe Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas-Evolving Electrodes
- Charles W. Tobias
- 2019
- JES
PaperSelective dry etching of germanium with respect to silicon and vice versa
- G.S. Oehrlein
- T.D. Bestwick
- et al.
- 2019
- JES
Paper