Wire bond behavior during molding operations of electronic packages
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
Paper
Publications
14467 results for Physical Sciences
Soluble polysilanes: An interesting new class of radiation sensitive materials
- R.D. Miller
- D. Hofer
- et al.
- 2004
- Polymer Engineering & Science
PaperStress development in supported polymer films during thermal cycling
- Ho-Ming Tong
- C.-K. Hu
- et al.
- 2004
- Polymer Engineering & Science
PaperRecent advances in the photodecomposition mechanisms of diazo‐oxides
- J. Pacansky
- 2004
- Polymer Engineering & Science
PaperEffect of tensile strain, time, and temperature on gas transport in biaxially oriented polystyrene
- Giovanni Levita
- Thor L. Smith
- 2004
- Polymer Engineering & Science
PaperOrganosilicon polymers for lithographic applications
- J.M. Shaw
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science
PaperResidual stresses in polymeric passivation and encapsulation materials
- I.C. Noyan
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
PaperConcerning voids in polyimide
- T.P. Russell
- 2004
- Polymer Engineering & Science
PaperPhotochemical free‐volume generation in poly(methyl methacrylate) photoresists
- William Limm
- Mitchell A. Winnik
- et al.
- 2004
- Polymer Engineering & Science
PaperStress‐Cracking of high density polyethylene in detergents
- Koksal Tonyali
- Charles E. Rogers
- et al.
- 2004
- Polymer Engineering & Science
Paper