Electrochemically Deposited Diffusion Barriers
- Milan Paunovic
- Robert G. Schad
- et al.
- 1994
- JES
Paper
Publications
509 results at JES
Intrinsic and Passivation-Induced Trench Tapering during Plasma Etching
- S. Hamaguchi
- M. Dalvie
- 1994
- JES
PaperHigh Selectivity Magnetically Enhanced Reactive Ion Etching of Boron Nitride Films
- Bernhard Neureither
- Son Nguyen
- et al.
- 1994
- JES
PaperShallow n+ Junctions in Silicon by Arsenic Gas-Phase Doping
- J.F. DeGeolormo
- D.K. Sodana
- et al.
- 1994
- JES
PaperThin Film Transistors with Graded SiNx Gate Dielectrics
- Yue Kuo
- 1994
- JES
PaperIn Situ Surface Exafs Study of an Underpotentially Deposited Silver Monolayer on Gold (111)
- Mahesh G. Samant
- Gary Borges
- et al.
- 1993
- JES
PaperBehavior of Cu(P) and Oxygen Free High Conductivity Cu Anodes under Electrodeposition Conditions
- H.S. Isaacs
- A.G. Schroft
- et al.
- 1993
- JES
PaperThe Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
PaperElectrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
PaperCorrosion Inhibition of Cobalt with a Thin Film of Cu-BTA
- B.M. Rush
- G.S. Frankel
- et al.
- 1993
- JES
Paper