Intrinsic and Passivation-Induced Trench Tapering during Plasma Etching
- S. Hamaguchi
- M. Dalvie
- 1994
- JES
Paper
Publications
509 results at JES
Electrolytic Codeposition of Ni-γAl2O3 Thin Films
- Patrick R. Webb
- Neil L. Robertson
- 1994
- JES
PaperElectrochemically Deposited Diffusion Barriers
- Milan Paunovic
- Robert G. Schad
- et al.
- 1994
- JES
PaperX-Ray Absorption Study of Electrochemically Grown Oxide Films on AlCr Sputtered Alloys
- A.J. Davenport
- H.S. Isaacs
- et al.
- 1994
- JES
PaperHigh Selectivity Magnetically Enhanced Reactive Ion Etching of Boron Nitride Films
- Bernhard Neureither
- Son Nguyen
- et al.
- 1994
- JES
PaperChemical Vapor Deposited Copper from Alkyne Stabilized Copper (I) Hexafluoroacetylacetonate Complexes
- Thomas H. Baum
- Carl E. Larson
- 1993
- JES
PaperElectrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
PaperOn the Pitting Resistance of Sputter-Deposited Aluminum Alloys
- R.C. Newman
- C.V. Jahnes
- et al.
- 1993
- JES
PaperThe Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
PaperIn Situ Surface Exafs Study of an Underpotentially Deposited Silver Monolayer on Gold (111)
- Mahesh G. Samant
- Gary Borges
- et al.
- 1993
- JES
Paper