Submicron mapping of silicon-on-insulator strain distributions induced by stressed liner structures
- Conal E. Murray
- K.L. Saenger
- et al.
- 2008
- Journal of Applied Physics
Paper
Publications
2360 results at Journal of Applied Physics
A method for increasing the etch-rate ratio of oxides to nonoxides in inert-gas ion milling processes
- U. Gerlach-Meyer
- J.W. Coburn
- et al.
- 2008
- Journal of Applied Physics
PaperX-ray photoelectron spectroscopy and Auger electron spectroscopy studies of glow discharge Si1-xCx:H films
- Wen-Yaung Lee
- 2008
- Journal of Applied Physics
PaperParallel silicide contacts
- I. Ohdomari
- K.N. Tu
- 2008
- Journal of Applied Physics
PaperThe implication of flow-rate dependencies in plasma etching
- B.N. Chapman
- T.A. Hansen
- et al.
- 2008
- Journal of Applied Physics
PaperDipole layers at the metal-SiO2 interface
- T.W. Hickmott
- 2008
- Journal of Applied Physics
PaperThe application of elastobirefringence to the study of strain fields and dislocations in III-V compounds
- H. Booyens
- J.H. Basson
- 2008
- Journal of Applied Physics
PaperQuasiresonant laser-produced plasma: An efficient mechanism for localized breakdown
- A.C. Tam
- 2008
- Journal of Applied Physics
PaperObservations on the hexagonal form of MoSi2 and WSi2 films produced by ion implantation and on related snowplow effects
- F.M. d'Heurle
- C.S. Petersson
- et al.
- 2008
- Journal of Applied Physics
PaperMetal-containing fluoropolymer films produced by simultaneous plasma etching and polymerization: Effects of hydrogen or oxygen
- E. Kay
- A. Dilks
- et al.
- 2008
- Journal of Applied Physics
Paper