Modeling of two-phase evaporative heat transfer in three-dimensional multicavity high performance microprocessor chip stacks
- Yassir Madhour
- Brian P. D'Entremont
- et al.
- 2014
- ASME Journal of Electronic Packaging
Paper
Publications
26945 results for Science
Temperature-dependent studies of the electrical properties and the conduction mechanism of HfOx-based RRAM
- Chiyui Ahn
- Seyoung Kim
- et al.
- 2014
- VLSI-TSA 2014
Conference paperThe resilience wall: Cross-layer solution strategies
- Subhasish Mitra
- Pradip Bose
- et al.
- 2014
- VLSI-TSA 2014
Conference paperCross-layer path management in multi-path transport protocol for mobile devices
- Yeon-Sup Lim
- Yung-Chih Chen
- et al.
- 2014
- INFOCOM 2014
Conference paperPractical DCB for improved data center networks
- Brent Stephens
- Alan L. Cox
- et al.
- 2014
- INFOCOM 2014
Conference paperMonitor placement for maximal identifiability in network tomography
- Liang Ma
- Ting He
- et al.
- 2014
- INFOCOM 2014
Conference paperOn the effect of forwarding table size on SDN network utilization
- Rami Cohen
- Liane Lewin-Eytan
- et al.
- 2014
- INFOCOM 2014
Conference paperDistributed backup scheduling: Modeling and optimization
- Peter M. Van De Ven
- Bo Zhang
- et al.
- 2014
- INFOCOM 2014
Conference paperTideWatch: Fingerprinting the cyclicality of big data workloads
- Dan Williams
- Shuai Zheng
- et al.
- 2014
- INFOCOM 2014
Conference paperKeep Forwarding: Towards k-link failure resilient routing
- Baohua Yang
- Junda Liu
- et al.
- 2014
- INFOCOM 2014
Conference paper