Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
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- IBM J. Res. Dev
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Publications
745 results at IBM J. Res. Dev
High-speed electrical testing of multichip ceramic modules
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- 2005
- IBM J. Res. Dev
PaperBlue Gene/L performance tools
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- 2005
- IBM J. Res. Dev
PaperThe chemistry of additives in damascene copper plating
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- 2005
- IBM J. Res. Dev
PaperExploring the limits of prefetching
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- 2005
- IBM J. Res. Dev
PaperBlue Gene/L compute chip: Memory and ethernet subsystem
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- IBM J. Res. Dev
PaperMixing, rheology, and stability of highly filled thermal pastes
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- IBM J. Res. Dev
PaperBlue Gene/L compute chip: Control, test, and bring-up infrastructure
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- IBM J. Res. Dev
PaperBladeCenter thermal diagnostics
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- IBM J. Res. Dev
PaperElectrochemical planarization of interconnect metallization
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- et al.
- 2005
- IBM J. Res. Dev
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