Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
Paper
Publications
745 results at IBM J. Res. Dev
Logic-based eDRAM: Origins and rationale for use
- Richard E. Matick
- Stanley E. Schuster
- 2005
- IBM J. Res. Dev
PaperExploitation of optical interconnects in future server architectures
- Alan F. Benner
- Michael Ignatowski
- et al.
- 2005
- IBM J. Res. Dev
ReviewMicrominiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements
- Mary Yvonne Lanzerotti
- Giovanni Fiorenza
- et al.
- 2005
- IBM J. Res. Dev
ReviewThe evolution of build-up package technology and its design challenges
- Edmund D. Blackshear
- Moises Cases
- et al.
- 2005
- IBM J. Res. Dev
ReviewRecent developments in high-moment electroplated materials for recording heads
- Emanuel I. Cooper
- Christian Bonhôte
- et al.
- 2005
- IBM J. Res. Dev
ReviewBladeCenter solutions
- Lynn S. Fore
- David W. Cosby
- et al.
- 2005
- IBM J. Res. Dev
ReviewLow-cost wafer bumping
- Peter A. Gruber
- Luc Bélanger
- et al.
- 2005
- IBM J. Res. Dev
ReviewFinishing line scheduling in the steel industry
- Hiroyuki Okano
- Andrew J. Davenport
- et al.
- 2004
- IBM J. Res. Dev
PaperNovel efficient techniques for computer simulation of magnetic recording
- D.M. Newns
- W.E. Donath
- et al.
- 2004
- IBM J. Res. Dev
Paper