64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Conference paper
Publications
24902 results for Exploratory Science
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
Conference paperImprovement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner
- M. Tagami
- C.-C. Yang
- et al.
- 2011
- IITC/MAM 2011
Conference paperCVD Co capping layers for Cu/low-k interconnects: Cu em enhancement vs. Co thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2011
- IITC/MAM 2011
Conference paperFuture of PECVD and spin-on ultra low-k materials
- Willi Volksen
- Theo Frot
- et al.
- 2011
- IITC/MAM 2011
Conference paperSingle-molecule chemistry and physics explored by low-temperature scanning probe microscopy
- Ingmar Swart
- Leo Gross
- et al.
- 2011
- Chemical Communications
PaperICT enabled Smart Rural Aggregation Platform
- Piyush Maheshwari
- Shalini Kapoor
- et al.
- 2011
- SRII 2011
Conference paperOptimizing cross enterprise collaboration using a coordination hub
- Saeed Bagheri
- Daniel V. Oppenheim
- 2011
- SRII 2011
Conference paperAutomated optimal dispatching of service requests
- Anubha Verma
- Nirmit V. Desai
- et al.
- 2011
- SRII 2011
Conference paperMunicipal shared services cloud
- Stacy Hobson
- Rangachari Anand
- et al.
- 2011
- SRII 2011
Conference paper