Tensile fracture and fractographic analysis of 1045 spheroidized steel under hydrostatic pressure
- A.S. Kao
- W.A. Spitzig
- et al.
- 2011
- Journal of Materials Research
Paper
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113 results at Journal of Materials Research
The effect of grain size on microstructure and stress relaxation in polycrystalline Y1Ba2Cu3O7-δ
- T.M. Shaw
- S. Shinde
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- 2011
- Journal of Materials Research
PaperMicroscratch and load relaxation tests for ultra-thin films
- T.W. Wu
- 2011
- Journal of Materials Research
PaperSilicide precipitation and silicon crystallization in nickel implanted amorphous silicon thin films
- R.C. Cammarata
- C.V. Thompson
- et al.
- 2011
- Journal of Materials Research
PaperSome Titanium Germanium and Silicon Compounds: Reaction and Properties
- O. Thomas
- F.M. d' Heurle
- et al.
- 2011
- Journal of Materials Research
PaperThin-film interactions and their relevance to electronic packaging
- Chin-An Chang
- 2011
- Journal of Materials Research
PaperEffects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
PaperSuperconducting thin films of the Bi-Sr-Ca-Cu-O system prepared by multilayer metal deposition
- D.J. Mikalsen
- R.A. Roy
- et al.
- 2011
- Journal of Materials Research
PaperAmbient dependence of the interactions in Pt/Ni/Cu and Au/Ni/ Cu structures
- Chin-An Chang
- 2011
- Journal of Materials Research
PaperBase electrodes for high dielectric constant oxide materials in silicon technology
- A. Grill
- W. Kane
- et al.
- 2011
- Journal of Materials Research
Paper