Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
Conference paper
Publications
24861 results for Exploratory Science
Hybrid reference metrology exploiting patterning simulation
- Narender Rana
- Chas Archie
- 2010
- SPIE Advanced Lithography 2010
Conference paperCloud-based platform for personalization in a wellness management ecosystem: Why, what, and how
- Pei-Yun S. Hsueh
- Raymund J. R. Lin
- et al.
- 2010
- CollaborateCom 2010
Conference paperAn importance sampling method for portfolio CVaR estimation with gaussian copula models
- Pu Huang
- Dharmashankar Subramanian
- et al.
- 2010
- WSC 2010
Conference paperQuality of IT service delivery - Analysis and framework for human error prevention
- Laura Shwartz
- Daniela Rosu
- et al.
- 2010
- SOCA 2010
Conference paperStabilizer subsystem codes with spatially local generators
- Sergey Bravyi
- 2010
- ITW 2010
Conference paperWafer scale fabrication of carbon nanotube FETs with embedded poly-gates
- Shu-Jen Han
- Josephine Chang
- et al.
- 2010
- IEDM 2010
Conference paperSmaller, smarter, faster, and more accurate: The new overlay metrology
- 2010
- SPIE Advanced Lithography 2010
Conference paperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Conference paperHandling Noisy queries in cross language FAQ retrieval
- Danish Contractor
- Govind Kothari
- et al.
- 2010
- EMNLP 2010
Conference paper