Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Paper
Publications
26923 results for Science
Effects of Ti addition to Sn-Ag and Sn-Cu solders
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- Journal of Alloys and Compounds
PaperComputer-aided simple triage (CAST) for coronary CT angiography (CCTA)
- Roman Goldenberg
- Dov Eilot
- et al.
- 2012
- IJCARS
PaperOn demand string sorting over unbounded alphabets
- Carmel Kent
- Moshe Lewenstein
- et al.
- 2012
- Theoretical Computer Science
PaperCost and complexity of harnessing games with payments
- Raphael Eidenbenz
- Yvonne Anne Pignolet
- et al.
- 2012
- International Game Theory Review
PaperPartially supervised speaker clustering
- Hao Tang
- Stephen Mingyu Chu
- et al.
- 2012
- IEEE TPAMI
PaperExploring context and content links in social media: A latent space method
- Guo-Jun Qi
- Charu Aggarwal
- et al.
- 2012
- IEEE TPAMI
PaperSynergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
PaperSolution path for manifold regularized semisupervised classification
- Gang Wang
- Fei Wang
- et al.
- 2012
- IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics
PaperCo capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
Paper