Low dielectric constant SiCOH films as potential candidates for interconnect dielectrics
- A. Grill
- L. Perraud
- et al.
- 1999
- MRS Spring Meeting 1999
Paper
Publications
14466 results for Physical Sciences
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperCharacterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperMechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperClassification of the modes of dissociation in immiscible Cu-alloy thin films
- K. Barmak
- G.A. Lucadamo
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperThe future of silicide for CMOS contacts
- R.A. Roy
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperIn-situ study of Ti/TiN stability under nitrogen anneal
- P. DeHaven
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperPhysics of organic light-emitting devices
- J.C. Scott
- George G. Malliaras
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperHigh-dielectric constant insulators and the AMLCD process: is amorphous BST a candidate?
- P. Andry
- D.A. Neumayer
- et al.
- 1999
- MRS Spring Meeting 1999
Conference paperComparison of Cl2/He, Cl2/Ar, and Cl2/Xe plasma chemistries for dry etching of NiFe and NiFeCo
- K.B. Jung
- H. Cho
- et al.
- 1999
- JES
Paper