Copper microstructure: Effect on electromigration void evolution
- C. Witt
- V. Calero
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
26883 results for Science
Spatial signature in local overlay measurements - "what CD-SEM can tell us and optical measurements can not"
- Scott Halle
- Daniel Moore
- et al.
- 2010
- SPIE Advanced Lithography 2010
Conference paperVoltage polarity effects in GST-based phase change memory: Physical origins and implications
- A. Padilla
- G.W. Burr
- et al.
- 2010
- IEDM 2010
Conference paperPrivacy-preserving publication of diagnosis codes for effective biomedical analysis
- Grigorios Loukides
- Aris Gkoulalas-Divanis
- et al.
- 2010
- ITAB 2010
Conference paperA two-level loan portfolio optimization problem
- JianQiang Hu
- Jun Tong
- et al.
- 2010
- WSC 2010
Conference paperEffective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Conference paperRF performance of short channel graphene field-effect transistor
- Yanqing Wu
- Yu-Ming Lin
- et al.
- 2010
- IEDM 2010
Conference paperUsing simulation-based stochastic approximation to optimize staffing of systems with skills-based-routing
- Zohar Feldman
- Avishai Mandelbaum
- 2010
- WSC 2010
Conference paperProcessing and moisture effects on TDDB for Cu/ULK BEOL structures
- Eric G. Liniger
- T.M. Shaw
- et al.
- 2010
- ADMETA 2010
Conference paperAn efficient approach to detect lack of synchronization in acyclic workflow graphs
- Cédric Favre
- 2010
- ZEUS 2010
Conference paper