D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applicationsKatsuyuki SakumaRoy Yuet al.2024IEDM 2024
Heterogeneous Embedded Neural Processing Units Utilizing PCM-based Analog In-Memory ComputingIrem Boybat-KaraThomas Boeschet al.2024IEDM 2024
Challenges in the implementation of artificial intelligence hardware based on phase change devicesGuy CohenAmlan Majumdaret al.2024MRS Fall Meeting 2024
Energy-Efficient Phase-Change Memory Disc-Type Cells Leveraging Ultrathin Phase-Change FilmsTimothy PhilipGhazi Sarwat Syedet al.2024MRS Fall Meeting 2024
Complex Optimization Problem Solving with Low Variability Neuromorphic VO2-Based OscillatorsOlivier MaherValeria Bragagliaet al.2024MRS Fall Meeting 2024
Analog Conductive-Metal-Oxide/HfOx ReRAM Devices - BEOL Integration, Characterization and ModellingDonato Francesco FalconeValeria Bragagliaet al.2024MRS Fall Meeting 2024
RETRO-LI: Small-Scale Retrieval Augmented Generation Supporting Noisy Similarity Searches and Domain Shift GeneralizationGentiana RashitiKumudu Geethan Karunaratneet al.2024ECAI 2024
Demonstration of 4-quadrant analog in-memory matrix multiplication in a single modulationManuel Le GalloOscar Hrynkevychet al.2024npj Unconv. Comput.
Advancements in Memristor Device Development: From Material Stack Optimization to Physical ModellingValeria BragagliaDonato Francesco Falconeet al.2024B-MRS 2024