Behavior of Cu(P) and Oxygen Free High Conductivity Cu Anodes under Electrodeposition Conditions
- H.S. Isaacs
- A.G. Schroft
- et al.
- 1993
- JES
Paper
Publications
14466 results for Physical Sciences
Vertical transport and tunnelling through squeezable quantum dots
- N. Blanc
- P. Guéret
- et al.
- 1993
- Physica B: Physics of Condensed Matter
PaperElectromagnetic fields in a radio-frequency induction plasma
- J. Hopwood
- C.R. Guarnieri
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperAn Ion Transfer Model for Contact Charging
- A. Diaz
- D. Fenzel-Alexander
- 1993
- Langmuir
PaperPerformance of a Flux Locked Series SQUID Array
- V. Foglietti
- K. Stawiasz
- et al.
- 1993
- IEEE TAS
PaperThe Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects
- H.Y. Cheh
- J. Dukovic
- et al.
- 1993
- JES
PaperQuantum tunneling and dissipation in nanometer-scale magnets
- Daniel Loss
- David P. DiVincenzo
- et al.
- 1993
- Physica B: Physics of Condensed Matter
PaperScaling properties of the shadowing model for sputter deposition
- Joachim Krug
- Paul Meakin
- 1993
- Physical Review E
PaperThe instability of the steady flow past spheres and disks
- Ramesh Natarajan
- Andreas Acrivos
- 1993
- Journal of Fluid Mechanics
PaperTetrahedrally coordinated Cr5+ in SrTiO3
- K.A. Müller
- K.W. Blazey
- et al.
- 1993
- Solid State Communications
Paper