The use of peel tests to examine the self adhesion of polyimide films
- H.R. Brown
- A.C.M. Yang
- 1992
- Journal of Adhesion Science and Technology
Paper
Publications
14466 results for Physical Sciences
Shallow junctions, silicide requirements and process technologies for sub 0.5 μm CMOS. Invited review paper
- Bijan Davari
- 1992
- Microelectronic Engineering
PaperPicosecond backside optical detection of internal signals in flip-chip mounted silicon VLSI circuits
- H. Heinrich
- N. Pakdaman
- et al.
- 1992
- Microelectronic Engineering
PaperModeling of arbitrarily shaped signal lines and discontinuities
- Barry J. Rubin
- 1992
- IEEE T-MTT
PaperExperimental and theoretical studies of oxygen ordering in quenched and slow-cooled YBa2Cu3O7
- L.E. Levine
- M. Däumling
- 1992
- Physical Review B
PaperAn XPS investigation of the adsorption of aminosilanes onto metal substrates
- M.R. Horner
- F.J. Boerio
- et al.
- 1992
- Journal of Adhesion Science and Technology
PaperSystematic study of insulator-metal transitions in perovskites RNiO3 (R=Pr,Nd,Sm,Eu) due to closing of charge-transfer gap
- J.B. Torrance
- P. Lacorre
- et al.
- 1992
- Physical Review B
PaperPoly(Aryl ether‐phenylquinoxaline)s: Self‐polymerization of an A—B monomer via quinoxaline‐activated ether synthesis
- Jeff W. Labadie
- J.L. Hedrick
- et al.
- 1992
- Journal of Polymer Science Part A: Polymer Chemistry
PaperPolysilane photoresists for 193 and 248 nm lithography
- G.M. Wallraff
- R.D. Miller
- et al.
- 1992
- J. Photopolym. Sci. Tech.
PaperTime delay in wave packet tunneling
- R. Landauer
- Th. Martin
- 1992
- Solid State Communications
Paper