High temperature process limitation on TiSi2
- C.-Y. Ting
- F.M. d'Heurle
- et al.
- 2019
- JES
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Publications
14458 results for Physical Sciences
Reactive ion Etching of Silicon and Silicon Dioxide in CF4 Plasmas Containing H2 or C2F4 Additives
- J.P. Simko
- 2019
- JES
PaperVarious Properties of Sputter-Deposited HfB2 Films
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- A.R. Forouhi
- et al.
- 2019
- JES
PaperA Mathematical Model for Silicide Oxidation
- S.-L. Zhang
- R. Ghez
- et al.
- 2019
- JES
PaperPit Growth in Nife Thin Films
- B.M. Rush
- J. Dukovic
- et al.
- 2019
- JES
PaperTranspassive Dissolution of 420 Stainless Steel in Concentrated Acids under Electropolishing Conditions
- M. Datta
- D. Vercruysse
- 2019
- JES
PaperElimination of End-of-Range Shallow Junction Implantation Damage during CMOS Titanium Silicidation
- G.A. Rozgonyi
- 2019
- JES
PaperCurrent status of reduced temperature silicon epitaxy by chemical vapor deposition
- B.S. Meyerson
- 2019
- JES
PaperStructural Effects on a Submicron Trench Process
- Daeje Chin
- Sang H. Dhong
- et al.
- 2019
- JES
PaperElectrochemical and Metallurgical Aspects of Laser-Enhanced Jet Plating of Gold
- M.H. Gelchinski
- L. Romankiw
- et al.
- 2019
- JES
Paper