Publications

2 results at ICEP 2021

Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2021
- ICEP 2021
Conference paper
Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- - Toyohiro Aoki
  - Katsuhiro Yoshida
  - et al.
- 2021
- ICEP 2021
Conference paper