Model-to-hardware correlations in the design of a 50Gb/s package
- Lei Shan
- Mounir Meghelli
- et al.
- 2003
- ECTC 2003
Conference paper
Publications
4 results at ECTC 2003
A method of multi-node thermal network extraction for SPICE compatible simulations
- Lei Shan
- Daniel Kuchta
- et al.
- 2003
- ECTC 2003
Conference paperStudy of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Won Kyoung Choi
- Sung K. Kang
- et al.
- 2003
- ECTC 2003
Conference paperFormation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Conference paper