TEMPERATURE DEPENDENCE OF STRESSES IN Ti, Cr, AND Cu THIN FILMS.C.-K. HuD. Guptaet al.1984VMIC 1984Conference paper
STRESS DEVELOPMENT IN POLYMER COATINGS DURING THERMAL CYCLING - A BENDING - BEAM APPROACH.C.-K. HuHo-Ming Tonget al.1984VMIC 1984Conference paper
MICROSTRUCTURE STUDIES OF Al-Cu SUBMICRON INTERCONNECTION.T. KwokC.-Y. Tinget al.1984VMIC 1984Conference paper
USE OF TiSi//2 FOR SELF ALIGNED SILICIDE (SALICIDE) TECHNOLOGY.C.-Y. TingSubramanian S. Iyer1984VMIC 1984Conference paper