Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2017
- ECTC 2017
Conference paper
Publications
5 results at ECTC 2017
Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
- Luca Del Carro
- Jonas Zuercher
- et al.
- 2017
- ECTC 2017
Conference paperThermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
Conference paperNovel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
Conference paperOptoelectronic Chip Assembly Process of Optical MCM
- Masao Tokunari
- Koji Masuda
- et al.
- 2017
- ECTC 2017
Conference paper