Publications

6 results at ITherm 2025

Topology Optimization for Embedded Cooling of Multiple and Transient Workloads in 3D Semiconductor Packages
- - Zekun Wu
  - Ashwin Kidambi
  - et al.
- 2025
- ITherm 2025
Conference paper
Effect of Pressure-dependent TIM Thermal Resistance on Thermal Performance of First-level Packages
- - KALIND BARAYA
  - Krishna Tunga
  - et al.
- 2025
- ITherm 2025
Conference paper
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- - Amogh Wasti
  - Zongmin Yang
  - et al.
- 2025
- ITherm 2025
Conference paper
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- - Max Bloomfield
  - Amogh Wasti
  - et al.
- 2025
- ITherm 2025
Conference paper
Two-Phase Cooling System Performance Under Different Operating Scenario
- - Pritish Parida
  - Timothy Chainer
- 2025
- ITherm 2025
Paper
Effect of Pin-Shapes on Chip-Embedded Two-Phase Cooling
- - Pritish Parida
- 2025
- ITherm 2025
Paper