Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Conference paper
Publications
9 results at ECTC 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Conference paperA Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Conference paperSurface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Conference paperSuper Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Conference paperDimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Conference paperThermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Conference paperSolder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paper