Future of PECVD and spin-on ultra low-k materials
- Willi Volksen
- Theo Frot
- et al.
- 2011
- IITC/MAM 2011
Conference paper
Publications
6 results at IITC/MAM 2011
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
Conference paperOptimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- D. Kioussis
- E.T. Ryan
- et al.
- 2011
- IITC/MAM 2011
Conference paper64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Conference paperImprovement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner
- M. Tagami
- C.-C. Yang
- et al.
- 2011
- IITC/MAM 2011
Conference paperCVD Co capping layers for Cu/low-k interconnects: Cu em enhancement vs. Co thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2011
- IITC/MAM 2011
Conference paper