Publications

6 results at VLSI-TSA 2010

Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
- - K.N. Chen
  - Cyril Cabral Jr.
  - et al.
- 2010
- VLSI-TSA 2010
Conference paper
Challenges and opportunities of extremely thin SOI (ETSOI) CMOS technology for future low power and general purpose system-on-chip applications
- - A. Khakifirooz
  - Kangguo Cheng
  - et al.
- 2010
- VLSI-TSA 2010
Conference paper
Carbon based graphene nanoelectronics technologies
- - Chun Yung Sung
  - Yu-Ming Lin
  - et al.
- 2010
- VLSI-TSA 2010
Conference paper
Effective schottky barrier lowering for contact resistivity reduction using silicides as diffusion sources
- - Zhen Zhang
  - F. Pagette
  - et al.
- 2010
- VLSI-TSA 2010
Conference paper
Silicon millimeter-wave radios for 60 GHz and beyond
- - Brian A. Floyd
  - Alberto Valdes-Garcia
  - et al.
- 2010
- VLSI-TSA 2010
Conference paper
Innovation in solid state devices for exascale computing
- - Tze-Chiang Chen
- 2010
- VLSI-TSA 2010
Conference paper