Chris Bottoms

Publications

• Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching

  • • Chris Bottoms
    • Sarah Nahar Chowdhury
    • et al.
  • 2026
  • SPIE Advanced Lithography + Patterning 2026

  Conference paper

• Multi-reticle stitching: Applications from packaging to High-NA EUV

  • • Chris Bottoms
    • Rick Johnson
    • et al.
  • 2025
  • SPIE Advanced Lithography + Patterning 2025

  Conference paper

• Massive E-beam Metrology Characterization of Reticle Stitching Boundaries

  • • Genevieve Kane
    • Connor Smith
    • et al.
  • 2025
  • SPIE Advanced Lithography + Patterning 2025

  Talk

• Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes

  • • Katherine Sieg
    • Chris Bottoms
    • et al.
  • 2024
  • SPIE Advanced Lithography + Patterning 2024

  Conference paper