Edward J. Nowak, Ingo Aller, et al.
IEEE Circuits and Devices Magazine
This paper presents a new self-alignment concept for scaled-down bipolar transistors: the self-aligned lateral profile. Using this concept to form the impurity profile and combining it with a wraparound base contact to reduce the emitter-base contact spacing and an n+-polyrefractory metal emitter stack to reduce the emitter resistance, a highperformance and potentially high-yield device structure can be obtained. The device structure can be adapted to a CMOS or merged bipolar-CMOS process and can also be easily optimized for analog applications. Copyright © 1987 by The Institute of Electrical and Electronics Engineers, Inc.
Edward J. Nowak, Ingo Aller, et al.
IEEE Circuits and Devices Magazine
Meng-Hsueh Chiang, Tze-Neng Lin, et al.
IEEE SOI 2006
Jente B. Kuang, Keunwoo Kim, et al.
IEEE Transactions on VLSI Systems
Ching-Te Chuang, Denny D. Tang, et al.
IEEE Journal of Solid-State Circuits