E. Liniger, C. Dziobkowski
Thin Solid Films
The (buried) interface between a polycrystalline Al thin-film feature and its substrate (single crystal Si) was characterized with x-ray microdiffraction. Using a focused x-ray beam (effective spot size on the specimen ∼2×12 μm) with the Si 004 reflection, topographic images of the Si around and under the metallization feature were constructed. Comparison with shear-lag model calculations indicate that the interface is not fully coupled despite the absence of surface cracks. © 1998 American Institute of Physics.
E. Liniger, C. Dziobkowski
Thin Solid Films
C.-K. Hu, L. Gignac, et al.
Journal of Applied Physics
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SPIE Advanced Lithography 2011
J.R. Lloyd, E. Liniger, et al.
Microelectronics Reliability