Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Mikhail Treger
- et al.
- 2016
- IEEE T-DMR
Paper
Publications
66 results for I.C. Noyan
Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
PaperCharacterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
- Mikhail Treger
- Christian Witt
- et al.
- 2013
- Journal of Applied Physics
PaperEvolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Robert Rosenberg
- et al.
- 2013
- Journal of Applied Physics
PaperProbing strain at the nanoscale with X-ray diffraction in microelectronic materials induced by stressor elements
- Conal E. Murray
- S. Polvino
- et al.
- 2013
- Thin Solid Films
PaperNanoscale strain characterization in microelectronic materials using X-ray diffraction
- Conal E. Murray
- Andrew Ying
- et al.
- 2012
- Powder Diffraction
PaperNanoscale silicon-on-insulator deformation induced by stressed liner structures
- Conal E. Murray
- Andrew Ying
- et al.
- 2011
- Journal of Applied Physics
PaperA quantitative analysis of room temperature recrystallization kinetics in electroplated copper films using high resolution x-ray diffraction
- Andrew Ying
- Christian Witt
- et al.
- 2011
- Journal of Applied Physics
PaperModeling of kinematic diffraction from a thin silicon film illuminated by a coherent, focused X-ray nanobeam
- Andrew Ying
- Braxton Osting
- et al.
- 2010
- Journal of Applied Crystallography
PaperA rigorous comparison of X-ray diffraction thickness measurement techniques using silicon-on-insulator thin films
- Andrew J. Ying
- Conal E. Murray
- et al.
- 2009
- Journal of Applied Crystallography
Paper