Cooling compute: Building the near future of direct-to-chip cooling

Exponential growth of AI workloads is driving the need for high performance chip packages that cannot be thermally managed by energy- and water-intensive chilled air-cooling solutions implemented in Data Centers today. Consequently, energy-efficient thermal management of IT Equipment utilizing some form of liquid cooling is gaining traction from a performance, cost and sustainability perspective. This talk will cover exemplar near future direct-to-chip cooling highlighting the benefits (and challenges) of utilizing liquid cooling.