What’s Next in Semiconductors
is powering full-stack AI
The way the world computes is shifting. Over the last decade, demand for AI applications has grown exponentially. Pipelines are getting more complex, and the world needs new hardware to train and serve AI at the scale enterprise demands. At IBM Research, we’re building the hardware and the tools to serve cutting-edge AI. We’re pushing the limits of semiconductor design, packaging, and connectivity, with innovations like sub-2 nm node chips, co-packaged optics, the AIU family of chips, and 3D nanosheet transistor technology. We’re building tomorrow’s AI supercomputers from the ground up.
Our work
- ExplainerPeter Hess
Introducing the first sub-1 nanometer node chip — the smallest, most powerful chip technology in the world
NewsMike MurphyHow to run AI workloads on mixed GPUs quickly and affordably
NewsKim MartineauBringing quantum-centric supercomputing to Illinois
Q & AKim MartineauIBM demonstrates extreme scale for content-aware storage with a 100-billion vector database
NewsPeter HessBuilding PyTorch-native support for the IBM Spyre Accelerator
Technical noteRaghu Ganti, Mudhakar Srivatsa, Elpida Tzortzatos, Viji Srinivasan, Vaidyanathan Srinivasan, and Tabari Alexander- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Publication collections
IEEE Electronic Components and Technology Conference
26 MaySPIE Advanced Lithography + Patterning
22 FebIEEE International Solid-State Circuits Conference
15 FebIEDM 2025
11
IEEE International Electron Devices Meeting
06 Dec