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IBM demonstrates High NA EUV process capability on track for insertion below 2 nm nodes at SPIE 2026Technical noteLuciana Meli23 Feb 2026Semiconductors
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From atoms to chips: Thermonat models heat with unprecedented accuracyNewsPeter Hess20 Jan 2026Hardware TechnologyPhysical SciencesSemiconductors
A new advance in a two-century pursuit in physicsTechnical noteOki Gunawan, Doug Bishop, and Bonfilio Nainggolan07 Jan 2026Physical SciencesScienceSemiconductors
Accelerating AI inference with IBM Storage ScaleTechnical noteYue Zhu, Radu Stoica, Animesh Trivedi, Jonathan Terner, Frank Schmuck, Jeremy Cohn, Christof Schmitt, Anthony Hsu, Guy Margalit, Vasily Tarasov, Swaminathan Sundararaman, Talia Gershon, and Vincent Hsu18 Nov 2025AIData ManagementHybrid Cloud Infrastructure
It takes a village to make open infrastructure for AI a realityNewsPeter Hess18 Nov 2025AIAI HardwareGenerative AIHardware TechnologyHybrid Cloud InfrastructureOpen SourceScaling AI
Expanding AI model training and inference for the open-source communityNewsPeter Hess21 Oct 2025AIAI HardwareGenerative AIHybrid CloudOpen Source
Building the IBM Spyre AcceleratorReleasePeter Hess07 Oct 2025AIAI HardwareGenerative AIHardware TechnologySemiconductors
IBM researchers win prestigious European grantsNewsPeter Hess and Mike Murphy04 Sep 2025AI HardwareHardware TechnologyQuantum SafeSecuritySemiconductors
How the IBM Research AI Hardware Center is building tomorrow’s processorsDeep DivePeter Hess12 Aug 2025AIAI HardwareGenerative AIHardware TechnologySemiconductors
IBM Storage Scale delivers real-world performance: an in-depth analysisTechnical noteBrian Belgodere, Chris Miller, John Lewars, Matthew Klos, Yukio Hayashi Leon, Mara Miranda Bautista, and Olaf Weiser04 Aug 2025AIHybrid CloudHybrid Cloud Infrastructure
National Academy of Engineering recognizes T.C. Chen’s role in semiconductor evolution Q & APeter Hess11 Jun 2025Hardware TechnologySemiconductors