Paper

09 Dec 2019

Effect of Plating Parameters on Electrodeposition of NiFe

View publication

Abstract

No abstract available.

Paper

Formation of molecular ions during sputtering

Ming L. Yu

Physical Review B

Paper

Hierarchical hydrodynamic flow confinement: Efficient use and retrieval of chemicals for microscale chemistry on surfaces

Julien Autebert, Aditya Kashyap, et al.

Langmuir

Conference paper

Investigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cables

Andreas C. Cangellaris, Karen M. Coperich, et al.

EMC 2001

Paper

Superconductivity of lanthanum intermetallic compounds with the Cu₃Au structure

R.J. Gambino, N.R. Stemple, et al.

Journal of Physics and Chemistry of Solids

View all publications