Ph. Avouris, R. Marte, et al.
Applied Physics A: Materials Science and Processing
We report on the low-temperature reaction of ammonia with Si(100)-(2×1). The dangling bonds in the clean Si surface promote NH3 dissociation even at temperatures as low as 90 K. The N atoms thus produced occupy subsurface sites, while the H atoms bind to surface Si atoms, tie up the dangling bonds, and inactivate the surface. Thermal or electronic-excitation- induced hydrogen desorption restores the dangling bonds and the reactivity of the surface. Silicon nitride film growth is achieved at 90 K by simultaneous exposure of the Si surface to NH3 and an electron beam. © 1986 The American Physical Society.
Ph. Avouris, R. Marte, et al.
Applied Physics A: Materials Science and Processing
S.J. Wind, J. Appenzeller, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
D. Schmeisser, C.M. Weinert, et al.
Chemical Physics Letters
R.E. Walkup, Ph. Avouris
Surface Science