The Microstructure of Transition Metal/Al(Cu) Layers

The microstructures of Hf/Al(Cu) and Ti/Al(Cu) bilayers have been investigated using transmission electron microscopy. Both flat-on and cross-sectional techniques were used to study the effects of annealing and Cu addition on the grain structure and interfacial morphology. While the Al-Hf system exhibits irregular morphology with spike formation, which becomes smoother with Cu addition, the Al-Ti system has significantly smoother morphology with or without Cu addition. © 1987, The Electrochemical Society, Inc. All rights reserved.