C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Conference paper
Publications
20 results for Stephen L. Buchwalter
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Conference paperC4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
Conference paperLead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007
Conference paperBuilding a packaging hierarchy for optical interconnects using polymer waveguides: Exploring the options
- Stephen L. Buchwalter
- Russell Budd
- et al.
- 2006
- GBC 2006
Conference paperEffects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
PaperOrganic Chemistry on a Polyimide Surface
- Richard R. Thomas
- Stephen L. Buchwalter
- et al.
- 2002
- Macromolecules
PaperThe Complementary Redox Properties of Viologens and Pyromellitimides: A New Class of Organic Conductors
- Stephen L. Buchwalter
- Revathi Iyengar
- et al.
- 2002
- JACS
PaperDevelopment of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
PaperDevelopment of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Paper