Advanced metallization developments for 32-nm node CMOS technology contact architecture
- Doug H. Lee
- Valli Arunachalam
- et al.
- 2009
- ADMETA 2009
Conference paper
Publications
13 results for Dan Mocuta
High performance 32nm SOI CMOS with high-k/metal gate and 0.149μm 2 SRAM and ultra low-k back end with eleven levels of copper
- B. Greene
- Q. Liang
- et al.
- 2009
- VLSI Technology 2009
Conference paperExtending dual stress liner process to high performance 32nm node SOI CMOS manufacturing
- M. Cai
- B. Greene
- et al.
- 2008
- IEEE International SOI Conference 2008
Conference paperHigh-performance nMOSFET with in-situ phosphorus-doped embedded Si:C (ISPD eSi:C) source-drain stressor
- B. Yang
- R. Takalkar
- et al.
- 2008
- IEDM 2008
Conference paperRecent progress and challenges in enabling embedded Si:C technology
- B. Yang
- Z. Ren
- et al.
- 2008
- ECS Meeting 2008
Conference paperRTA-driven intra-die variations in stage delay, and parametric sensitivities for 65nm technology
- I. Ahsan
- N. Zamdmer
- et al.
- 2006
- VLSI Technology 2006
Conference paperHigh performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL
- W.-H. Lee
- A. Waite
- et al.
- 2005
- IEDM 2005
Conference paperHigh performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- E. Leobandung
- H. Nayakama
- et al.
- 2005
- VLSI Technology 2005
Conference paperRetardation of arsenic diffusion in silicon-germanium by co-implantation
- Omer Dokumaci
- Paul Ronsheim
- et al.
- 2004
- ECS Meeting 2004
Conference paperA hydrogen pre-bake process for Si epitaxy on sige surface
- H. Chen
- S.W. Bedell
- et al.
- 2004
- ECS Meeting 2004
Conference paper