Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
Conference paper
Publications
17 results for C. Kothandaraman
3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
Conference paperA cost effective 32nm high-K/metal gate CMOS technology for low power applications with single-metal/gate-first process
- X. Chen
- S. Samavedam
- et al.
- 2008
- VLSI Technology 2008
Conference paperReliability investigation of NiPtSi electrical fuse with different programming mechanisms
- C. Tian
- D. Moy
- et al.
- 2007
- IIRW 2007
Conference paperA compact eFUSE programmable array memory for SOI CMOS
- John Safran
- Alan Leslie
- et al.
- 2007
- VLSI Circuits 2007
Conference paperElectrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips
- Norm Robson
- John Safran
- et al.
- 2007
- CICC 2007
Conference paperReliability qualification of CoSI2 electrical fuse for 90NM technology
- C. Tian
- B. Park
- et al.
- 2006
- IRPS 2006
Conference paper