Lithographic Innovations for Advanced Packaging: Enabling Scalable Integration Across Large FieldsAlex HubbardChristopher Carret al.2026SPIE Advanced Lithography + Patterning 2026Conference paper
Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging SchemesKatherine SiegChris Bottomset al.2024SPIE Advanced Lithography + Patterning 2024Conference paper