Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- Chris Bottoms
- Sarah Nahar Chowdhury
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Publications
4 results for Alex Hubbard
Lithographic Innovations for Advanced Packaging: Enabling Scalable Integration Across Large Fields
- Alex Hubbard
- Christopher Carr
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paperMulti-reticle stitching: Applications from packaging to High-NA EUV
- Chris Bottoms
- Rick Johnson
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperLarge Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes
- Katherine Sieg
- Chris Bottoms
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paper