Graphite Sheet Embedded in an Organic Flip-Chip Package for Heat Spreading
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
28 results for Akihiro Horibe
Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John U. Knickerbocker
- Jean Benoit Herou
- et al.
- 2025
- ECTC 2025
Conference paperSelf-Alignment of Active Si Bridge using Solder Joint Capillary Forces
- Thomas Lesueur
- David Danovitch
- et al.
- 2025
- ECTC 2025
Conference paperPhotonic Modules with High Density Polymer Waveguide Interface
- J.B. Héroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Conference paperScalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Conference paperNext Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Conference paperSuper Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Conference paperCharacterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Conference paperDimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Conference paperVertical interconnect technology for enlarging capacity on micro solid thin film rechargeable battery
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2019
- ECTC 2019
Conference paper