Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
Conference paper
Publications
28 results for Akihiro Horibe
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013
Conference paperScaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Conference paperThermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
Conference paperNo Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
Conference paperVacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
Conference paperVacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Conference paperHigh channel count connector for optical interconnect
- Yoichi Taira
- Fumiaki Yamada
- et al.
- 2008
- OF&T 2008
Conference paper