Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Conference paper
Publications
57 results for Takeshi Nogami
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
Conference paperImpact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams
- Akira Uedono
- Takeshi Nogami
- et al.
- 2023
- Journal of Applied Physics
PaperAdvanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Conference paperElectromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- T. Nogami
- S. Nguyen
- et al.
- 2021
- IEDM 2021
Conference paperImpact of Nanosecond Laser Anneal on PVD Ru Films
- D. Sil
- Yasir Sulehria
- et al.
- 2021
- IITC 2021
Conference paperDual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Conference paperRole of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
PaperNovel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
Conference paperComposite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020
Conference paper