Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and its Reliability
- Minhua Lu
- Joyce Liu
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
120 results for Stephan A. Cohen
Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
Conference paperShort Time Annealing of Coevaporated Tungsten Silicide Films
- T.O. Sedgwick
- F.M. d'Heurle
- et al.
- 2019
- JES
PaperElectrical Properties of Chemical-Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers
- S. Cohen
- M.A. Jaso
- et al.
- 2019
- JES
PaperExtreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
PaperElectromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- C. K. Hu
- James Kelly
- et al.
- 2017
- IITC 2017
Conference paperLow hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Conference paperLow hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
PaperAdvanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB
PaperTriangular Voltage Sweep (TVS) characterisation for Through-Silicon-Via (TSV) reliability
- C. Kothandaraman
- Stephan A. Cohen
- 2016
- IRPS 2016
Conference paper